The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Aug. 28, 2018
Applicant:
Laird Technologies, Inc., Chesterfield, MO (US);
Inventors:
Jason L. Strader, Cleveland, OH (US);
Michael S. Wladyka, Brocksville, OH (US);
Keith David Johnson, Westlake, OH (US);
Jingting Yang, Fremont, CA (US);
Kevin Joel Bohrer, Parma, OH (US);
Mark D. Kittel, Berea, OH (US);
Assignee:
Laird Technologies, Inc., Chesterfield, MO (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/67 (2006.01); H01L 23/552 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); B32B 38/00 (2006.01); B32B 38/06 (2006.01); B32B 37/00 (2006.01); H01L 21/48 (2006.01); B23P 15/26 (2006.01); H01L 21/683 (2006.01); H01L 31/0203 (2014.01); B23P 15/20 (2006.01);
U.S. Cl.
CPC ...
H01L 24/743 (2013.01); B32B 37/025 (2013.01); B32B 38/0004 (2013.01); B32B 38/06 (2013.01); H01L 21/4882 (2013.01); H01L 21/67132 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01); H01L 23/552 (2013.01); H01L 24/27 (2013.01); H01L 24/97 (2013.01); B23P 15/20 (2013.01); B23P 15/26 (2013.01); B32B 2457/00 (2013.01); H01L 21/6835 (2013.01); H01L 31/0203 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27602 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); Y10T 29/53178 (2015.01); Y10T 29/53265 (2015.01);
Abstract
A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.