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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741500 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

May. 04, 2018

Electronic package

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chen-Yu Huang, Taichung, TW;

Chee-Key Chung, Taichung, TW;

Chang-Fu Lin, Taichung, TW;

Kong-Toon Ng, Taichung, TW;

Rui-Feng Tai, Taichung, TW;

Bo-Hao Ma, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 24/13 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81385 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

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