The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Mar. 29, 2018
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Tiburcio Maldo, Consolacion, PH;
Keunhyuk Lee, Suzhou, CN;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
A semiconductor package assembly has a leadframe that includes a socket member into which solderless pins may be inserted as interconnects to an external component. The cost of manufacturing such a leadframe is reduced without sacrificing the ability to make solderless connections with external components such as PCBs. For example, instead of using a hard material that requires two stamping tools, the leadframes with female sockets may be made using softer copper-based materials. Moreover, the width of such leadframes is significantly smaller than the width of a leadframe with the press-fit pins included. Such a reduced width may further reduce manufacturing costs.