The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Mar. 23, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Cheng-Lung Yang, Kaohsiung, TW;

Chih-Hung Su, Hsinchu, TW;

Chen-Shien Chen, Hsinchu County, TW;

Hon-Lin Huang, Hsinchu, TW;

Kun-Ming Tsai, Hsinchu, TW;

Wei-Je Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/528 (2013.01); H01L 24/10 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/3213 (2013.01);
Abstract

Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor devices includes a first conductive layer, an organic layer, a silicon layer, a magnetic layer and a second conductive layer. The organic layer is disposed over and exposes a portion of the first conductive layer. The silicon layer is disposed on and in contact with the organic layer. The magnetic layer is disposed over the first conductive layer. The second conductive layer is disposed over the organic layer and the magnetic layer to electrically connect the first conductive layer.


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