The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jan. 17, 2019
Applicant:
Laird Technologies, Inc., Chesterfield, MO (US);
Inventors:
Jason L. Strader, Cleveland, OH (US);
Eugene Anthony Pruss, Avon Lake, OH (US);
Assignee:
LAIRD TECHNOLOGIES, INC., Chesterfield, MO (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C09K 5/14 (2006.01); C08L 25/08 (2006.01); C08J 9/228 (2006.01); C08J 9/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); C08J 9/0066 (2013.01); C08J 9/228 (2013.01); C08L 25/08 (2013.01); C09K 5/14 (2013.01); H01L 23/552 (2013.01); C08J 2203/22 (2013.01); C08J 2325/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/20 (2013.01);
Abstract
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.