The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Sep. 06, 2018
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Masaki Noguchi, Yokkaichi, JP;

Tatsunori Isogai, Yokkaichi, JP;

Tomonori Aoyama, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 27/11582 (2017.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0214 (2013.01); H01L 21/0228 (2013.01); H01L 21/02211 (2013.01); H01L 27/11582 (2013.01); H01L 29/40117 (2019.08);
Abstract

In one embodiment, a method of manufacturing a semiconductor device includes alternately forming a plurality of first films and a plurality of second films on a substrate, and forming an opening in the first and second films. The method further includes sequentially forming a first insulator, a charge storage layer, a second insulator and a semiconductor layer on surfaces of the first and second films in the opening. The second insulator includes a silicon oxynitride film, and the silicon oxynitride film is formed using a first gas that includes silicon and a first element, a second gas that includes oxygen and nitrogen, and a third gas that includes a second element that reacts with the first element.


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