The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

May. 11, 2018
Applicant:

Tektronix, Inc., Beaverton, OR (US);

Inventors:

Julie A. Campbell, Beaverton, OR (US);

Regina R. Mrozik, Troutdale, OR (US);

Assignee:

Tektronix, Inc., Beaverton, OR (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); H05K 3/32 (2006.01); G01R 1/067 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0416 (2013.01); G01R 1/06755 (2013.01); G01R 1/06788 (2013.01); G01R 3/00 (2013.01); H05K 3/321 (2013.01);
Abstract

A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.


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