The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Apr. 28, 2015
Applicants:

Dow Global Technologies Llc, Midland, MI (US);

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Lingli Duan, Shanghai, CN;

Chen Chen, Shanghai, CN;

Shaoguang Feng, Shanghai, CN;

Zukhra I. Niazimbetova, Westborough, MA (US);

Maria Anna Rzeznik, Shrewsbury, MA (US);

Assignees:

Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D 413/12 (2006.01); C25D 3/38 (2006.01); C07D 241/04 (2006.01); C07D 265/33 (2006.01); C07D 413/06 (2006.01); C07D 413/10 (2006.01); C25D 3/30 (2006.01);
U.S. Cl.
CPC ...
C07D 413/12 (2013.01); C07D 241/04 (2013.01); C07D 265/33 (2013.01); C07D 413/06 (2013.01); C07D 413/10 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01);
Abstract

Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.


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