The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jun. 12, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Matthew Busche, Santa Clara, CA (US);

Wendell Boyd, Jr., Morgan Hill, CA (US);

Todd J. Egan, Fremont, CA (US);

Gregory L. Kirk, Pleasanton, CA (US);

Vijay D. Parkhe, San Jose, CA (US);

Michael R. Rice, Pleasanton, CA (US);

Leon Volfovski, Pacifica, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/26 (2006.01); H01L 21/67 (2006.01); H05B 3/14 (2006.01);
U.S. Cl.
CPC ...
H05B 3/265 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H05B 3/14 (2013.01); H05B 2203/032 (2013.01); H05B 2203/037 (2013.01);
Abstract

Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.


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