The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

May. 07, 2019
Applicant:

Camtek Ltd., Migdal Haemek, IL;

Inventor:

Eyal Segev, Migdal Haemek, IL;

Assignee:

CAMTEK LTD., Midal Haemek, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); G01B 11/0625 (2013.01); H01L 22/12 (2013.01); H01L 2224/117 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11618 (2013.01);
Abstract

A method for estimating a thickness related to multiple conductive structural elements of an object, the method includes estimating a height difference between an upper surface of a conductive structural element and an upper surface of a photoresists layer portion that surrounds the conductive structural element, to provide multiple height differences; estimating thicknesses of the multiple photoresists layer portions, based at least on the second part of the emitted radiation; and calculating thickness values related to the multiple conductive structural elements, wherein the calculating is based at least on the multiple height differences and on the estimated thickness of the multiple photoresists layer portions.


Find Patent Forward Citations

Loading…