The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Jan. 26, 2017
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Shuji Nishimoto, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 23/40 (2006.01); H01L 23/08 (2006.01); H01L 23/15 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 21/4867 (2013.01); H01L 23/08 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/3735 (2013.01); H01L 23/40 (2013.01); H01L 23/488 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H01L 23/473 (2013.01); H01L 2224/039 (2013.01); H01L 2224/03505 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/03901 (2013.01); H01L 2224/279 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2744 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/27901 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83487 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3512 (2013.01); H05K 1/0306 (2013.01);
Abstract
An Ag underlayer-attached metallic member includes a metallic member joined with a body to be joined and an Ag underlayer formed on a joining surface of the metallic member with the body to be joined, the Ag underlayer includes a glass layer formed on a metallic member side and an Ag layer laminated on the glass layer, and an area proportion of voids in an Ag layer surface of the Ag underlayer is 25% or less.