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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10732508 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Jul. 08, 2019

Coating and developing method and coating and developing apparatus

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shinichiro Kawakami, Koshi, JP;

Hiroshi Mizunoura, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-ku, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/26 (2006.01); G03F 7/30 (2006.01); B05D 1/32 (2006.01); B05D 1/00 (2006.01); B05D 1/36 (2006.01); G03F 7/004 (2006.01); G03F 7/16 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/3057 (2013.01); B05D 1/005 (2013.01); B05D 1/32 (2013.01); B05D 1/322 (2013.01); B05D 1/36 (2013.01); G03F 7/0043 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/3021 (2013.01); G03F 7/32 (2013.01); G03F 7/38 (2013.01); G03F 7/70991 (2013.01); H01L 21/0274 (2013.01);
Abstract

A coating and developing method includes: a step that applies a resist containing a metal to a front surface of a substrate to form a resist film, and exposes the resist film; a developing step that supplies a developer to the front surface of the substrate to develop the resist film; and a step that forms, before the developing step, a first protective film on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer from coming into contact with the peripheral part of the substrate, wherein the first protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.

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