The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Sep. 07, 2018
Applicant:
Imec Vzw, Leuven, BE;
Inventors:
Sandip Halder, Bierbeek, BE;
Philippe Leray, La Hulpe, BE;
Assignee:
IMEC VZW, Leuven, BE;
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/88 (2006.01); G03F 7/20 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G03F 7/7065 (2013.01); G03F 7/70616 (2013.01); G03F 7/70641 (2013.01); G06T 7/0006 (2013.01); G01N 21/956 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30242 (2013.01);
Abstract
Example embodiments relate to methods for detecting defects of a lithographic pattern. One example embodiment includes a method for detecting defects of a lithographic pattern on a semiconductor wafer that includes a plurality of die areas. Each of the die areas has a region of interest (ROI) that includes a plurality of features forming the lithographic pattern. The method includes acquiring an image of at least one of the ROIs. The method also includes removing features touching an edge of the image. Further, the method includes counting a number of remaining features in the image.