logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10730273 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Aug. 28, 2018

Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yoichiro Ichioka, Annaka, JP;

Naoyuki Kushihara, Annaka, JP;

Kazunori Kondo, Takasaki, JP;

Kazuaki Sumita, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Peter D Mulcahy

Int. Cl.
CPC ...
B32B 27/26 (2006.01); C08K 3/36 (2006.01); C08L 83/06 (2006.01); H01L 21/02 (2006.01); C08K 5/13 (2006.01); B32B 27/38 (2006.01); C08L 63/10 (2006.01); C08G 77/52 (2006.01); C08L 63/00 (2006.01); C08G 59/22 (2006.01); C08G 59/30 (2006.01); C09D 183/16 (2006.01); C08G 77/60 (2006.01); C08G 59/32 (2006.01); C08G 77/44 (2006.01); C08L 83/00 (2006.01); C08G 77/50 (2006.01); C08K 5/15 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
B32B 27/26 (2013.01); B32B 27/38 (2013.01); C08G 59/226 (2013.01); C08G 59/306 (2013.01); C08G 59/3281 (2013.01); C08G 77/44 (2013.01); C08G 77/50 (2013.01); C08G 77/52 (2013.01); C08G 77/60 (2013.01); C08K 3/36 (2013.01); C08K 5/13 (2013.01); C08L 63/00 (2013.01); C08L 63/10 (2013.01); C08L 83/00 (2013.01); C08L 83/06 (2013.01); C09D 183/16 (2013.01); H01L 21/02126 (2013.01); B32B 2457/14 (2013.01); C08L 2312/04 (2013.01); H01L 33/56 (2013.01);
Abstract

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein 'A' represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Find Patent Forward Citations

Loading…