The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Aug. 19, 2019
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventor:
Po-Hsuan Liao, Taoyuan, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/107 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 3/465 (2013.01); H05K 3/4644 (2013.01); H05K 1/0219 (2013.01); H05K 1/0284 (2013.01); H05K 3/0023 (2013.01); H05K 3/0041 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09727 (2013.01); H05K 2203/06 (2013.01);
Abstract
A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.