The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Oct. 31, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Tatsuya Funaki, Nagaokakyo, JP;
Noriyuki Inoue, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01G 4/12 (2006.01); H01L 21/56 (2006.01); H01L 23/525 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01G 4/12 (2013.01); H01G 4/33 (2013.01); H01L 21/568 (2013.01); H01L 23/12 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/525 (2013.01); H01L 23/5223 (2013.01); H01L 24/18 (2013.01); H01L 23/3114 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/19 (2013.01);
Abstract
A wafer level package which includes an IC chip; a rewiring layer on the IC chip; and a capacitor embedded in the rewiring layer.