The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Jul. 10, 2019
Applicant:

Suzhou Han Hua Semiconductor Co., Ltd, Suzhou, CN;

Inventors:

Xianfeng Ni, Suzhou, CN;

Qian Fan, Suzhou, CN;

Wei He, Suzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02639 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 29/0684 (2013.01); H01L 29/66462 (2013.01); H01L 21/0262 (2013.01); H01L 21/02658 (2013.01);
Abstract

A method of fabricating a semiconductor structure includes: growing a dielectric layer on a substrate; defining an epitaxial region and a gap region on the dielectric layer; etching a dielectric layer of the epitaxial region to expose the substrate; sequentially growing a gallium nitride buffer layer and an aluminum gallium nitride barrier layer on the exposed substrate. The method of fabricating a semiconductor structure provided by the present application divides the aluminum gallium nitride barrier layer into a plurality of independent portions, thus preventing the microcracks from occurring in the aluminum gallium nitrogen film while increasing the aluminum component, thereby improving the yield rate and reliability of the device.


Find Patent Forward Citations

Loading…