The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Aug. 14, 2017
Applicant:
Shengyi Technology Co., Ltd., Guangdong, CN;
Inventors:
Xianping Zeng, Guangdong, CN;
Liexiang He, Guangdong, CN;
Assignee:
SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/04 (2006.01); B32B 5/26 (2006.01); B32B 15/092 (2006.01); B32B 17/04 (2006.01); C08J 5/24 (2006.01); C09K 21/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); B32B 5/26 (2013.01); B32B 15/092 (2013.01); B32B 17/04 (2013.01); C08J 5/24 (2013.01); C09K 21/12 (2013.01); H05K 1/0366 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08J 2363/04 (2013.01); C08J 2367/03 (2013.01); C08L 2201/02 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01);
Abstract
The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.