The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Sep. 20, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kohei Tanaka, Tokyo, JP;

Hidetoshi Mannami, Tokyo, JP;

Hisatoshi Fujisawa, Tokyo, JP;

Hiroshi Nomura, Tokyo, JP;

Wakana Onoe, Tokyo, JP;

Taiki Sawabe, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); H01L 21/67 (2006.01); B23K 26/359 (2014.01); B23K 26/00 (2014.01); H01L 21/673 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); B23K 26/064 (2014.01); B23K 26/06 (2014.01); B23K 26/067 (2006.01); B23K 26/08 (2014.01); H01L 21/677 (2006.01); H01L 21/78 (2006.01); B32B 15/01 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/0006 (2013.01); B23K 26/064 (2015.10); B23K 26/0626 (2013.01); B23K 26/0673 (2013.01); B23K 26/0853 (2013.01); B23K 26/359 (2015.10); B32B 15/011 (2013.01); H01L 21/6719 (2013.01); H01L 21/6773 (2013.01); H01L 21/67115 (2013.01); H01L 21/67346 (2013.01); H01L 21/67772 (2013.01); H01L 21/67778 (2013.01); H01L 21/68 (2013.01); H01L 21/68707 (2013.01); H01L 21/68714 (2013.01); H01L 21/78 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.


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