The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Mar. 31, 2017
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Michael A. Cullinan, Austin, TX (US);

Nilabh Kumar Roy, Austin, TX (US);

Anil Yuksel, Austin, TX (US);

Chee Seng Foong, Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 7/02 (2006.01); B22F 3/105 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); G06F 30/23 (2020.01); B23K 1/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); B23K 101/36 (2006.01); B22F 1/00 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
B22F 7/02 (2013.01); B22F 3/1055 (2013.01); B23K 1/0008 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); G06F 30/23 (2020.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/67115 (2013.01); H01L 23/3135 (2013.01); H01L 23/4985 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); B22F 1/0044 (2013.01); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2003/1059 (2013.01); B22F 2999/00 (2013.01); B23K 2101/36 (2018.08); H01L 21/67144 (2013.01); H01L 21/6838 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75261 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83054 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/83939 (2013.01); H01L 2224/9211 (2013.01); Y02P 10/295 (2015.11);
Abstract

A microscale selective laser sintering (μ-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm/hr while achieving a feature-size resolution of approximately 1 μm. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering μ-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 μm scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.


Find Patent Forward Citations

Loading…