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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10720751 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Aug. 30, 2018

Optical package structure, optical module, and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Yu-Hsuan Tsai, Kaohsiung, TW;

Lu-Ming Lai, Kaohsiung, TW;

Ying-Chung Chen, Kaohsiung, TW;

Shih-Chieh Tang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
G02B 6/02 (2006.01); H04B 10/50 (2013.01); G02B 6/35 (2006.01); G02B 6/42 (2006.01); H04B 10/80 (2013.01); H01S 5/022 (2006.01); H01L 31/0203 (2014.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01S 5/40 (2006.01); H01L 33/48 (2010.01); H01S 5/02 (2006.01); H01L 25/075 (2006.01); H01S 5/183 (2006.01); H01L 25/04 (2014.01); H01L 31/02 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02268 (2013.01); H01L 23/5385 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 31/0203 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01S 5/0216 (2013.01); H01S 5/0226 (2013.01); H01S 5/02208 (2013.01); H01S 5/02236 (2013.01); H01S 5/02272 (2013.01); H01S 5/4025 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 31/02002 (2013.01); H01L 2224/29084 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29138 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/40503 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H01S 5/02248 (2013.01); H01S 5/183 (2013.01);
Abstract

An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

Find Patent Forward Citations

Tsai, Yu-Hsuan. (2020). Optical package structure, optical module, and method for manufacturing the same (U.S. Patent No. 10720751). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10720751

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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