The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Apr. 07, 2017
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Heinz Moitzi, Zeltweg, AT;

Dietmar Drofenik, Spielberg, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/94 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/211 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semifinished product includes a base structure, wafer structures, a cover structure and a further cover structure. The base structure has an electrically conductive layer and/or an electrically insulating layer. The wafer structures are on the base structure and have electronic components. The cover structure has at least one further layer and covers the wafer structures and part of the base structure. Separate electronic components are arranged on the cover structure and a further cover structure is provided to cover the separate electronic components and part of the cover structure. A component carrier includes a bare die with pads. The bare die is laminated between a base laminate and a cover laminate and has a lateral semiconductor surface being exposed from the base laminate and the cover laminate. A redistribution layer increases spacing of external electric contacts relative to spacing between pads of the bare die.


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