The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Jun. 03, 2019
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Idan Kaizerman, Meitar, IL;

Yotam Sofer, Givataim, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01J 37/28 (2006.01); H01J 37/22 (2006.01); G03F 7/20 (2006.01); H01J 37/317 (2006.01); H01J 37/304 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G03F 7/7065 (2013.01); G03F 7/70558 (2013.01); G03F 7/70641 (2013.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); H01J 37/304 (2013.01); H01J 37/3174 (2013.01); H01L 22/20 (2013.01); H01J 2237/221 (2013.01); H01J 2237/2817 (2013.01); H01J 2237/30416 (2013.01); H01J 2237/30433 (2013.01); H01J 2237/30461 (2013.01); H01J 2237/31798 (2013.01);
Abstract

A method for process analysis includes acquiring first inspection data, using a first inspection modality, with respect to a substrate having multiple instances of a predefined pattern of features formed thereon using different, respective sets of process parameters. Characteristics of defects identified in the first inspection data are processed so as to select a first set of defect locations in which the first inspection data are indicative of an influence of the process parameters on the defects. Second inspection data are acquired, using a second inspection modality having a finer resolution than the first inspection modality, of the substrate at the locations in the first set. The defects appearing in the second inspection data are analyzed so as to select, from within the first set of the locations, a second set of the locations in which the second inspection data are indicative of an optimal range of the process parameters.


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