The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Sep. 28, 2010
Applicants:

Andrew Nguyen, San Jose, CA (US);

Farhat Quli, Hayward, CA (US);

Mei Sun, Los Altos, CA (US);

Vasudev Venkatesan, San Jose, CA (US);

Inventors:

Andrew Nguyen, San Jose, CA (US);

Farhat Quli, Hayward, CA (US);

Mei Sun, Los Altos, CA (US);

Vasudev Venkatesan, San Jose, CA (US);

Assignee:

KLA-TENCORE CORPORATION, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); G01J 5/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01J 37/32935 (2013.01); G01J 5/045 (2013.01); H01L 23/28 (2013.01);
Abstract

A sensor wafer may be configured for in-situ measurements of parameters during an etch process. The sensor wafer may include a substrate, a cover, and one or more components positioned between the substrate and the cover. An etch-resistant coating is formed on one or more surfaces of the cover and/or substrate. The coating is configured to resist etch processes that etch the cover and/or substrate for a longer period than standard thin film materials of the same or greater thickness than the protective coating.


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