The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Nov. 04, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Andrew Joseph Kelly, Hsinchu County, TW;

Yusuke Oniki, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/3063 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01); B82Y 10/00 (2011.01); C25F 3/12 (2006.01); H01L 29/417 (2006.01); C25F 7/00 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H01L 29/78 (2006.01); C25D 17/00 (2006.01); H01L 29/06 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67086 (2013.01); B82Y 10/00 (2013.01); C25D 17/00 (2013.01); C25F 3/12 (2013.01); C25F 7/00 (2013.01); H01L 21/02233 (2013.01); H01L 21/02258 (2013.01); H01L 21/28158 (2013.01); H01L 21/3063 (2013.01); H01L 21/30635 (2013.01); H01L 29/41725 (2013.01); H01L 29/41791 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/66742 (2013.01); H01L 29/66795 (2013.01); H01L 29/66818 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01); H01L 29/78684 (2013.01); H01L 29/78696 (2013.01); H01L 21/02236 (2013.01); H01L 21/02238 (2013.01); H01L 21/02241 (2013.01); H01L 29/0673 (2013.01); H01L 29/513 (2013.01); H01L 29/665 (2013.01); H01L 29/7853 (2013.01);
Abstract

A method includes forming a semiconductor fin on a semiconductor substrate, the semiconductor fin comprising germanium, silicon, silicon germanium or any of III-V elements; forming a mask layer on a top portion of the semiconductor fin; and trimming the semiconductor fin, wherein trimming the semiconductor fin comprises: immersing the semiconductor substrate in a first electrolyte bath; and laterally removing a first portion of the semiconductor fin by supplying a first voltage to a counter electrode in the electrolyte bath and a second voltage to the semiconductor substrate, wherein the second voltage is negative.


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