The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Jan. 30, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hotaka Maruyama, Gyeonggi-do, KR;

Katsunori Tanaka, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01J 37/32449 (2013.01); H01J 2237/334 (2013.01);
Abstract

An etching method for etching an etching target film using a first organic film processed to have a plurality of line patterns formed on the etching target film, an oxide film conformally formed on a front surface of the etching target film so as to provide a space between adjacent line patterns, and a second organic film formed to embed the space, includes etching back the second organic film and the oxide film using an etching gas whose etching selection ratio is adjusted for the second organic film based on a line width and a width of the space so as to cause an upper surface of the first organic film to be exposed, removing the oxide film between the line pattern and the space, and etching the etching target film using the first organic film and the second organic film as a mask.


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Maruyama, Hotaka. (2020). Etching method and etching apparatus (U.S. Patent No. 10720328). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10720328

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