The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Aug. 20, 2018
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Rolf H. Kuehnis, Portland, OR (US);

Sankaran M. Menon, Austin, TX (US);

Patrik Eder, Taufkirchen By, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/3177 (2006.01); G01R 31/317 (2006.01);
U.S. Cl.
CPC ...
G01R 31/3177 (2013.01); G01R 31/31705 (2013.01); G01R 31/31715 (2013.01); G01R 31/31723 (2013.01);
Abstract

Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.


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