logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10717901 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Nov. 02, 2016

Curable resin film and first protective film forming sheet

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Masanori Yamagishi, Phoenix, AZ (US);

Akinori Sato, Saitama, JP;

Assignee:

LINTEC Corporation, Tokyo, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Nathan L Van Sell

Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 201/00 (2006.01); H01L 21/304 (2006.01); C09J 7/00 (2018.01); B32B 27/08 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); B32B 27/08 (2013.01); B32B 27/26 (2013.01); B32B 27/38 (2013.01); C09J 7/00 (2013.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01); H01L 21/78 (2013.01); H01L 23/3171 (2013.01); H01L 24/27 (2013.01); C09J 7/383 (2018.01);
Abstract

This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm, and light intensity of 510 mJ/cm, a yellow index (YI) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Find Patent Forward Citations

Loading…