The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Sep. 29, 2015
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Makoto Fujimura, Tokyo, JP;
Youhei Tateishi, Tokyo, JP;
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H05K 3/005 (2013.01); H05K 3/007 (2013.01); H05K 3/0014 (2013.01); H05K 3/0055 (2013.01); H05K 3/422 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 3/0032 (2013.01); H05K 3/427 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1105 (2013.01);
Abstract
Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole.