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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10716203 B1

PDFFull Text
Date of Patent:
Jul. 14, 2020

Filed:

Apr. 28, 2016

Adhesive film and flexible metal laminate

Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Tomoya Hosoda, Chiyoda-ku, JP;

Eiichi Nishi, Chiyoda-ku, JP;

Toru Sasaki, Chiyoda-ku, JP;

Yasuhiko Matsuoka, Chiyoda-ku, JP;

Wataru Kasai, Chiyoda-ku, JP;

Assignee:

AGC Inc., Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Dean O Takaoka

Assistant Examiner:

Alan Wong

Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 15/08 (2006.01); C09J 7/30 (2018.01); C09J 127/18 (2006.01); B32B 7/12 (2006.01); C09J 7/22 (2018.01); H01P 11/00 (2006.01); H05K 3/38 (2006.01); B32B 27/28 (2006.01); C09J 179/08 (2006.01); H01P 3/08 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/281 (2013.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 127/18 (2013.01); C09J 179/08 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H05K 1/0237 (2013.01); H05K 1/0373 (2013.01); H05K 3/06 (2013.01); H05K 3/22 (2013.01); H05K 3/386 (2013.01); H05K 3/4652 (2013.01); B32B 2307/308 (2013.01); B32B 2457/08 (2013.01); C09J 2201/122 (2013.01); C09J 2201/128 (2013.01); C09J 2203/326 (2013.01); C09J 2427/00 (2013.01); C09J 2479/086 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0104 (2013.01);
Abstract

To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

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