The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Jun. 26, 2018
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventors:

Mingjun Wang, Shanghai, CN;

Xinxue Wang, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H04R 31/00 (2006.01); H04R 19/04 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 31/00 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01); H04R 2231/001 (2013.01);
Abstract

A microphone and its manufacturing method are presented. The manufacturing method includes providing a substrate; forming a ring opening extending from an upper surface of the substrate into the substrate; forming a ring separation component by forming a separation material in the ring opening; forming an insulation layer on the substrate; forming a front-end device on the insulation layer; and etching a back side of the substrate using the ring separation component and the insulation layer as an etch-stop layer to form a back-hole.


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