The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Nov. 29, 2018
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Chin-Sheng Wang, Hsinchu, TW;
Ra-Min Tain, Hsinchu County, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81447 (2013.01); H01L 2924/351 (2013.01);
Abstract
A chip module includes a body, a bump, and a first bonding layer. The bump is disposed on the body. The first bonding layer is disposed on the bump. The first bonding layers and the bump are made of the same conductive material and the first bonding layer is porous.