The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Jan. 10, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Shruti Rajeev Jaywant, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/76814 (2013.01); H01L 21/76879 (2013.01); H01L 21/76883 (2013.01); H01L 23/49894 (2013.01); H01L 23/5329 (2013.01);
Abstract
Integrated circuit interconnect structures having a metal oxide adhesive layer between conductive interconnects and dielectric material, as well as related apparatuses and methods are disclosed herein. For example, in some embodiments, an integrated circuit interconnect structure may include a dielectric layer having 60% or more filler, a conductive layer, and a metal oxide adhesive layer between the dielectric and conductive layers. In some embodiments, the metal oxide adhesive layer may include one or more of aluminum oxide, chromium oxide, and nickel oxide.