The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Sep. 20, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Thai Cheng Chua, Cupertino, CA (US);

Philip Allan Kraus, San Jose, CA (US);

Travis Lee Koh, Sunnyvale, CA (US);

Christian Amormino, Windsor, CA (US);

Jaeyong Cho, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01); C23C 16/511 (2006.01); C23C 16/505 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); C23C 16/50 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01); H01L 21/223 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); C23C 16/458 (2013.01); C23C 16/4586 (2013.01); C23C 16/45544 (2013.01); C23C 16/466 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); C23C 16/511 (2013.01); H01J 37/3244 (2013.01); H01J 37/32577 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6875 (2013.01); H01L 21/68742 (2013.01); H01L 21/68757 (2013.01); H01J 37/321 (2013.01); H01J 37/32192 (2013.01); H01J 2237/002 (2013.01); H01J 2237/334 (2013.01); H01L 21/02274 (2013.01); H01L 21/2236 (2013.01); H01L 21/3065 (2013.01);
Abstract

The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide independent pulses of DC voltage through a switching system to electrodes disposed through the ESC substrate support, or to electrodes disposed on a surface of the ESC, or to electrodes embedded in the ESC substrate support. The switching system can independently alter the frequency and duty cycle of the pulsed DC voltage that is coupled to each electrode. During processing of the substrate, the process rate, such as etch rate or deposition rate, can be controlled independently in regions of the substrate because the process rate is a function of the frequency and duty cycle of the pulsed DC voltage. The processing uniformity of the process performed on the substrate is improved.


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