The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Apr. 04, 2019
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Saibal Banerjee, Fremont, CA (US);

Jagdish Chandra Saraswatula, Chennai, IN;

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/67 (2006.01); G01N 21/95 (2006.01); H01J 37/22 (2006.01); G01N 21/956 (2006.01); G06F 30/398 (2020.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06F 30/398 (2020.01); H01J 37/226 (2013.01); H01L 21/67271 (2013.01);
Abstract

Methods and systems for shape metric based scoring of wafer locations are provided. One method includes selecting shape based grouping (SBG) rules for at least two locations on a wafer. For one of the wafer locations, the selecting step includes modifying distances between geometric primitives in a design for the wafer with metrology data for the one location and determining metrical complexity (MC) scores for SBG rules associated with the geometric primitives in a field of view centered on the one location based on the distances. The selecting step also includes selecting one of the SBG rules for the one location based on the MC scores. The method also includes sorting the at least two locations on the wafer based on the SBG rule selected for the at least two locations.


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