The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Nov. 29, 2018
Applicant:
Kemet Electronics Corporation, Simpsonville, SC (US);
Inventors:
Randal J. Vaughan, Simpsonville, SC (US);
Gregory L. Crosby, Simpsonville, SC (US);
Assignee:
KEMET Electronic Corporation, Fort Lauderdale, FL (US);
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 2/24 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/20 (2006.01); H01G 4/33 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); H01G 2/065 (2013.01); H01G 2/24 (2013.01); H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/20 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/306 (2013.01); H01G 4/33 (2013.01);
Abstract
A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. The method includes printing layers, forming a stack of the layers, sintering the stack, dicing the stack and forming external terminations.