The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Dec. 20, 2016
Applicant:
Fujimi Incorporated, Kiyosu-shi, Aichi, JP;
Inventors:
Hiroyuki Ibe, Kiyosu, JP;
Junya Yamada, Kiyosu, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); C04B 35/626 (2006.01); B22F 3/105 (2006.01); C04B 35/64 (2006.01); B28B 1/00 (2006.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); C22C 29/08 (2006.01); C22C 1/05 (2006.01); C22C 32/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0059 (2013.01); B22F 1/0014 (2013.01); B22F 1/0096 (2013.01); B22F 3/1055 (2013.01); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C04B 35/626 (2013.01); C04B 35/64 (2013.01); C22C 1/05 (2013.01); C22C 29/08 (2013.01); C22C 32/00 (2013.01); B22F 2304/10 (2013.01); B22F 2999/00 (2013.01);
Abstract
A molding material is provided which, despite containing a ceramic, enables efficient molding for producing high-density molded articles. The present invention provides a molding material to be used in powder laminate molding. This molding material contains a first powder which contains a ceramic, and a second powder which contains a metal. Further the first powder and the second powder are bonded by sintering to configure granulated sintered particles. The granule strength of the granulated sintered particles is greater than 1 MPa and less than 10,000 MPa.