The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Apr. 01, 2015
Applicant:
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H01L 24/20 (2013.01); H05K 1/185 (2013.01); H05K 3/007 (2013.01); H05K 3/10 (2013.01); H01L 21/568 (2013.01); H01L 24/19 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/73267 (2013.01); H05K 1/188 (2013.01); H05K 3/4682 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10159 (2013.01); H05K 2203/0147 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/095 (2013.01);
Abstract
A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.