The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Nov. 25, 2016
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Atsushi Ogasawara, Hanno, JP;

Fumihiro Homma, Hanno, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/268 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0638 (2013.01); H01L 21/268 (2013.01); H01L 21/76237 (2013.01);
Abstract

A semiconductor device manufacturing method includes: a pretreatment step of performing a hydrophobic treatment on a first exposed region of an exposed surface, an n-type semiconductor layer being exposed from the first exposed region, and a pn junction being exposed from the exposed surface; an impurity supplying step of supplying an n-type impurity to the first exposed region; a channel stopper forming step of irradiating the first exposed region with a laser beam to introduce the n-type impurity into the n-type semiconductor layer, thus forming a channel stopper; and a glass layer forming step of forming a glass layer using a glass composition so as to cover the exposed surface.


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