The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

May. 24, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ramachandra Divakaruni, Ossining, NY (US);

Arvind Kumar, Chappaqua, NY (US);

Carl J. Radens, Lagrangeville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11568 (2017.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01); H01L 27/12 (2006.01); H01L 29/40 (2006.01); H01L 29/792 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11568 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 27/1203 (2013.01); H01L 29/408 (2013.01); H01L 29/40117 (2019.08); H01L 29/66833 (2013.01); H01L 29/792 (2013.01); H01L 29/7926 (2013.01);
Abstract

A plurality of fin structures containing, from bottom to top, a non-doped semiconductor portion and a second doped semiconductor portion of a first conductivity type, extend upwards from a surface of a first doped semiconductor portion of the first conductivity type. A trapping material (e.g., an electron-trapping material) is present along a bottom portion of sidewall surfaces of each non-doped semiconductor portion and on exposed portions of each first doped semiconductor portion. Functional gate structures straddle each fin structure. Metal lines are located above each fin structure and straddle each functional gate structure. Each metal line is orientated perpendicular to each functional gate structure and has a bottommost surface that is in direct physical contact with a portion of a topmost surface of each of the second doped semiconductor portions.


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