The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Aug. 16, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yoshihiro Machida, Nagano, JP;

Nobuyuki Kurashima, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
F28D 15/043 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/046 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1432 (2013.01);
Abstract

A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.


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