The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jun. 02, 2015
Applicant:
Kuprion Inc., San Jose, CA (US);
Inventor:
Alfred A. Zinn, Palo Alto, CA (US);
Assignee:
Kuprion Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 3/14 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H01L 27/12 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); C09D 11/322 (2013.01); C09D 11/52 (2013.01); H05K 1/028 (2013.01); H05K 3/1283 (2013.01); H05K 3/14 (2013.01); H01L 21/4867 (2013.01); H01L 27/124 (2013.01); H01L 27/1292 (2013.01); H05K 3/02 (2013.01); H05K 3/4069 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01);
Abstract
An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.