Multi-chip hybrid system-in-package for providing interoperability and other enhanced features to high complexity integrated circuits

Abstract

An MCM-HIC device flexibly adds enhanced features to a VLSI 'core' IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one 'chiplet' that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or 'mixed' chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.