The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Jan. 18, 2019
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Yosuke Hanawa, Kyoto, JP;

Yuta Sasaki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/677 (2006.01); B08B 3/00 (2006.01); B08B 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); B08B 3/00 (2013.01); B08B 3/04 (2013.01); H01L 21/6715 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/67739 (2013.01); H01L 21/68 (2013.01);
Abstract

Disclosed is a substrate treating method comprising: a supply step of supplying a process liquid including a drying auxiliary substance in a melted state to a pattern formation surface of a substrate; a solidification step of solidifying the process liquid on the pattern formation surface so as to from a solidified body; and a removal step of removing the solidified body from the pattern formation surface, wherein a substance which satisfies at least one of the following conditions, namely a melting entropy under atmospheric pressure at a melting point of 1 mJ/cm·K or more but 500 mJ/cm·K or less and a sublimation entropy under atmospheric pressure at 0° C. of 1 mJ/cm·K or more but 2000 mJ/cm·K or less, is used as the drying auxiliary substance.


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