The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Feb. 11, 2015
Applicant:
Shengyi Technology Co., Ltd., Dongguan, Guangdong, CN;
Inventors:
Assignee:
SHENGYI TECHNOLOGY CO., LTD., Dongguan, CN;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/20 (2006.01); B32B 27/42 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); C08L 79/04 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); C08K 5/5399 (2006.01); C08K 5/521 (2006.01); B32B 27/16 (2006.01); C08L 79/08 (2006.01); C08K 5/3445 (2006.01); C08K 3/36 (2006.01); C08L 61/06 (2006.01); C08L 61/34 (2006.01); C08K 3/22 (2006.01); B32B 15/092 (2006.01); B32B 27/18 (2006.01);
U.S. Cl.
CPC ...
C08L 79/04 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/521 (2013.01); C08K 5/5399 (2013.01); C08L 61/06 (2013.01); C08L 61/34 (2013.01); C08L 63/00 (2013.01); C08L 79/085 (2013.01); H05K 1/0373 (2013.01); B32B 2264/102 (2013.01); B32B 2305/076 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/558 (2013.01); B32B 2457/08 (2013.01); C08J 2379/04 (2013.01); C08J 2463/00 (2013.01); C08J 2479/04 (2013.01); C08J 2479/08 (2013.01); C08L 2201/02 (2013.01); C08L 2201/08 (2013.01); C08L 2201/22 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); H05K 2201/012 (2013.01);
Abstract
The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.