The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Dec. 28, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sumita Basu, Portland, OR (US);

Shantanu D. Kulkarni, Hillsboro, OR (US);

Prosenjit Ghosh, Portland, OR (US);

Konstantin I. Kouliachev, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); H05K 1/02 (2006.01); H01L 23/427 (2006.01); F28D 15/04 (2006.01); G06F 1/20 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); F28F 13/16 (2006.01); F28C 3/08 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2006.01); F28D 21/00 (2006.01); F21V 8/00 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28C 3/08 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 15/0283 (2013.01); F28D 15/046 (2013.01); F28F 13/16 (2013.01); G06F 1/1601 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 23/427 (2013.01); H01L 23/5389 (2013.01); H05K 1/0203 (2013.01); H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 3/0017 (2013.01); H05K 3/0044 (2013.01); H05K 5/0017 (2013.01); H05K 7/20318 (2013.01); H05K 7/20809 (2013.01); F28D 2015/0225 (2013.01); F28D 2021/0029 (2013.01); F28F 2215/06 (2013.01); G02B 6/0085 (2013.01); G02F 1/133385 (2013.01); H05K 2201/064 (2013.01);
Abstract

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.


Find Patent Forward Citations

Loading…