The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

May. 17, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Nosun Park, Incheon, KR;

Changhan Hobie Yun, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Niranjan Sunil Mudakatte, San Diego, CA (US);

Xiaoju Yu, San Diego, CA (US);

Wei-Chuan Chen, San Diego, CA (US);

Assignee:

QUALCOMMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 27/40 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01); H03H 1/00 (2006.01); H03H 3/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 27/40 (2013.01); H01L 21/565 (2013.01); H01L 21/6836 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01); H01L 24/16 (2013.01); H01L 25/16 (2013.01); H01L 27/01 (2013.01); H01L 28/10 (2013.01); H01L 28/60 (2013.01); H03H 1/0007 (2013.01); H03H 3/00 (2013.01); H01L 24/13 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16268 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H03H 2001/005 (2013.01);
Abstract

A three-dimensional (3D) solenoid structure includes a first inductor portion having a first surface and a second surface opposite the first surface. The 3D solenoid structure further includes a first capacitor portion, a first inductor pillar, at least one capacitor pillar, a second inductor portion, a second inductor pillar and a first inductor bonding interface. The first inductor pillar is coupled to the first surface of the first inductor portion. The capacitor pillar(s) is coupled to the first capacitor portion. The second inductor portion includes a first surface and a second surface opposite the first surface. The second inductor pillar is coupled to the first surface of the second inductor portion. The first inductor bonding interface, between the first inductor pillar and the second inductor pillar, couples together the first inductor portion and the second inductor portion.


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