The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Sep. 10, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Tsui-Ling Yen, Zhubei, TW;

Chyi-Tsong Ni, Hsin-Chu, TW;

Ruei-Hung Jang, Jhubei, TW;

Bpin Lo, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 49/02 (2006.01); H01L 29/94 (2006.01); H01L 23/535 (2006.01); H01L 29/06 (2006.01); H01L 29/32 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 23/535 (2013.01); H01L 28/87 (2013.01); H01L 28/91 (2013.01); H01L 29/0649 (2013.01); H01L 29/32 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01);
Abstract

The present disclosure relates to a method of forming a deep trench capacitor. In some embodiments, the method may be performed by selectively etching a substrate to form a trench having serrated sidewalls defining a plurality of curved depressions. A dielectric material is formed within the trench. The dielectric material conformally lines the serrated sidewalls. A conductive material is deposited within the trench and is separated from the substrate by the dielectric material. The dielectric material is configured to act as a capacitor dielectric between a first electrode comprising the conductive material and a second electrode arranged within the substrate.


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