The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Nov. 09, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Min Gyu Sung, Essex, MA (US);

Jae Young Lee, Bedford, MA (US);

Johannes Van Meer, Middleton, MA (US);

Sony Varghese, Manchester, MA (US);

Naushad K. Variam, Marblehead, MA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/8234 (2006.01); H01L 21/768 (2006.01); H01L 29/10 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823481 (2013.01); H01L 21/76829 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/1083 (2013.01); H01L 29/7851 (2013.01);
Abstract

Disclosed are methods of forming a semiconductor device, such as a finFET device. One non-limiting method may include providing a semiconductor device including a substrate and a plurality of fins extending from the substrate, and forming a source trench isolation (STI) material over the semiconductor device. The method may further include recessing the STI material to reveal an upper portion of the plurality of fins, implanting the semiconductor device, and forming a capping layer over the plurality of fins and the STI material. The method may further include removing a first fin section of the plurality of fins and a first portion of the capping layer, wherein a second fin section of the plurality of fins remains following removal of the first fin section.


Find Patent Forward Citations

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Sung, Min. (2020). Fin damage reduction during punch through implantation of finfet device (U.S. Patent No. 10692775). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10692775

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