The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Jun. 14, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Makoto Tanaka, Tokyo, JP;

Takatoshi Kyo, Tokyo, JP;

Chan Kit Chee, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3043 (2013.01); H01L 21/67092 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A method of cutting a workpiece includes forming a guide groove to a depth smaller than the predetermined depth in the workpiece, the guide groove extending from the outer peripheral edge to an end portion of the device area, by causing a cutting blade to cut into the workpiece held on the holding surface of the chuck table from an outer peripheral edge of the workpiece along one of the projected dicing lines; and forming a groove to the predetermined depth in the workpiece along the projected dicing line, the groove extending from the device area beyond an opposite end of the device area to a portion of the outer peripheral extra area, after lowering the cutting blade toward and into the guide groove in the device area and then positioning a cutting edge thereof at the predetermined depth.


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